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28.04.09 / SMT 2009
…and to the SMT Hybrid Packaging in Nuremberg!
From 5th to 7th May 2009 at the "SMT" in Nuremberg, we will show you what matters when selecting and using flexible base materials in order to be able to react fast and effectively to the requirements of the market.
This is because the development of flexible printed circuits places the highest demands on base laminates.
Our electronics specialists and our proven base material AKAFLEX® are eagerly awaiting you and your wishes at Stand 9-449 in Hall 9.
In our download center you will find further information material.
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