AKAFLEX® is an all-inclusive product family of flexible and semi-flexible base materials, coverlay films, bonding films and adhesive prepregs. These products are designed for manufacturing flexible printed circuits and are characterised by many outstanding advantages:

• AKAFLEX® provides the right solution in meeting the technical and economic requirements by individual selection of the metal foils and backing materials for the particular job in question.
  
  
• AKAFLEX® can be processed by all common techniques for producing flexible circuit boards.
  
  
• AKAFLEX® stands for constancy in product quality - guaranteed by ISO 9001.
  
  
• AKAFLEX® meets the requirements of IPC specifications.
  
  
• AKAFLEX® polyimide-based laminates and coverlay films meet V0 according to UL 94 and are environmentally friendly thanks to our halogen-free adhesive systems.
  
  
• AKAFLEX® products are available on reels or supplied as sheets.

We manufacture two and three-layer laminates for manufacturing flexible printed circuits. The components are selected on the basis of the requirements for the circuit. The laminates therefore have distinct technical properties: AKAFLEX® PCL is available with different degrees of dimensional stability in accordance with IPC. AKAFLEX® PENCL is based on a backing film with a higher continuous-heat resistance. AKAFLEX® KCL stands out by its high peeling strength, excellent solder-bath resistance as well as its good dimensional stability.

Backing material:
PET = AKAFLEX® PCL
PEN = AKAFLEX® PENCL
PI = AKAFLEX® KCL
and others

Copper foil:
EDHD, RA

Adhesive:
Modified epoxy resin

We manufacture two and three-layer laminates for the production of semi-flexible printed circuits. AKAFLEX® GHE is a cost-effective and technically interesting alternative to the classic base materials. Even though the good stiffness of our laminate is conspicuous, it is still flexible and can be shaped and folded. AKAFLEX® GHE can be processed by all common techniques for producing flexible circuit boards and is suitable for all soldering processes and  SMD procedures.

Backing material:
Glass-fibre fabric prepreg
= AKAFLEX® GHE

 
Copper foil:
EDHD

 
Adhesive:
Modified epoxy resin

We manufacture coverlay films coated with adhesive on one side for protecting etched circuits, as well as bonding films coated with adhesive on both sides and adhesive prepregs for manufacturing high-quality multilayers.

Backing material:
PET = AKAFLEX® PDF and PTP
PEN = AKAFLEX® PENDF
PI = AKAFLEX® KDF
and others

Without backing material:
= AKAFLEX® CDF (adhesive film)

Adhesive:
Modified epoxy resin, polyester resin